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euclevel adhesives
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This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
https://www.pinterest.com/echipleveladhesives/
https://www.linkedin.com/in/eucleveladhesives/
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Member Since:
December 2022
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